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Jemmy Sutanto

Showing results (1-10 of 3) with videos related to

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Journal of Microelectromechanical Systems : a Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems|February 8, 2014
Novel First-Level Interconnect Techniques for Flip Chip on MEMS DevicesJemmy Sutanto, Sindhu Anand, Chetan Patel, et al.
Journal of Microelectromechanical Systems : a Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems|January 17, 2014
Electrothermal Microactuators With Peg Drive Improve Performance for Brain Implant ApplicationsSindhu Anand, Jemmy Sutanto, Michael S Baker, et al.
Journal of Microelectromechanical Systems : a Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems|January 17, 2014
Packaging and Non-Hermetic Encapsulation Technology for Flip Chip on Implantable MEMS DevicesJemmy Sutanto, Sindhu Anand, Arati Sridharan, et al.
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Showing results (1-10 of 3) with videos related to

Sort By:
Pageof 1
Journal of Microelectromechanical Systems : a Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems|February 8, 2014
Novel First-Level Interconnect Techniques for Flip Chip on MEMS DevicesJemmy Sutanto, Sindhu Anand, Chetan Patel, et al.
Journal of Microelectromechanical Systems : a Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems|January 17, 2014
Electrothermal Microactuators With Peg Drive Improve Performance for Brain Implant ApplicationsSindhu Anand, Jemmy Sutanto, Michael S Baker, et al.
Journal of Microelectromechanical Systems : a Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems|January 17, 2014
Packaging and Non-Hermetic Encapsulation Technology for Flip Chip on Implantable MEMS DevicesJemmy Sutanto, Sindhu Anand, Arati Sridharan, et al.
Pageof 1