Electrothermal Microactuators With Peg Drive Improve Performance for Brain Implant Applications
Sindhu Anand1, Jemmy Sutanto1, Michael S Baker2
1School of Biological and Health Systems Engineering, Arizona State University, Tempe, AZ 85287-9709 USA.
Journal of Microelectromechanical Systems : a Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems
|January 17, 2014
Summary
A new Chevron-peg actuation scheme for microelectromechanical systems (MEMS) microelectrodes offers improved performance for brain implants. This novel design provides higher force, lower power consumption, and enhanced durability compared to previous mechanisms.
Area of Science:
- Biomedical Engineering
- Materials Science
- Mechanical Engineering
Background:
- Previous microelectromechanical systems (MEMS) microelectrodes for brain implants faced limitations in performance and durability.
- In vivo testing revealed specific needs for improved actuation mechanisms.
Purpose of the Study:
- To introduce and evaluate a new Chevron-peg actuation scheme for polysilicon microelectrodes.
- To enhance the performance and longevity of microelectrodes for brain implant applications.
Main Methods:
- Development of a novel Chevron-peg actuation scheme utilizing MEMS electrothermal microactuators.
- Comparative analysis of Chevron-peg versus Chevron-latch actuation mechanisms.
- Optimization of activation waveform parameters using statistical analysis.
Main Results:
- The Chevron-peg scheme demonstrated higher force generation (111 μN vs. 50 μN) and reduced power consumption (91 mW vs. 360 mW).
- Failure analysis indicated superior robustness of the Chevron-peg design over four million operational cycles.
- Optimized waveforms (1-ms period, 1-Hz frequency) achieved minimal movement error.
Conclusions:
- The Chevron-peg actuation scheme significantly improves microelectrode performance for brain implants.
- This new generation of actuators is expected to increase the longevity and reliability of implanted devices.
