Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Filters

Maik Wiemer

Showing results (1-10 of 8) with videos related to

Pageof 1
Sort By:
Micromachines|June 27, 2024
Process Development of Aluminum Electroplating from an Ionic Liquid on 150 mm Wafer LevelSilvia Braun, Maik Wiemer, Stefan E Schulz
Micromachines|November 15, 2018
Aluminum Patterned Electroplating from AlCl₃⁻[EMIm]Cl Ionic Liquid towards Microsystems ApplicationMuhammad Salman Al Farisi, Silvia Hertel, Maik Wiemer, et al.
Micromachines|March 16, 2019
Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical ComponentsSylwester Bargiel, Maciej Baranski, Maik Wiemer, et al.
Polymers|December 11, 2022
Impact of Non-Accelerated Aging on the Properties of Parylene CFranz Selbmann, Christina Scherf, Jörn Langenickel, et al.
Applied Optics|September 15, 2015
Micro-optical design of a three-dimensional microlens scanner for vertically integrated micro-opto-electro-mechanical systemsMaciej Baranski, Sylwester Bargiel, Nicolas Passilly, et al.
Micromachines|February 25, 2023
Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible SubstratesFranz Selbmann, Soumya Deep Paul, Maulik Satwara, et al.
Micromachines|August 26, 2022
Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized CoilsChristian Hofmann, Maulik Satwara, Martin Kroll, et al.
Micromachines|November 9, 2018
Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression BondingKoki Tanaka, Wei-Shan Wang, Mario Baum, et al.
Pageof 1

Showing results (1-10 of 8) with videos related to

Sort By:
Pageof 1
Micromachines|June 27, 2024
Process Development of Aluminum Electroplating from an Ionic Liquid on 150 mm Wafer LevelSilvia Braun, Maik Wiemer, Stefan E Schulz
Micromachines|November 15, 2018
Aluminum Patterned Electroplating from AlCl₃⁻[EMIm]Cl Ionic Liquid towards Microsystems ApplicationMuhammad Salman Al Farisi, Silvia Hertel, Maik Wiemer, et al.
Micromachines|March 16, 2019
Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical ComponentsSylwester Bargiel, Maciej Baranski, Maik Wiemer, et al.
Polymers|December 11, 2022
Impact of Non-Accelerated Aging on the Properties of Parylene CFranz Selbmann, Christina Scherf, Jörn Langenickel, et al.
Applied Optics|September 15, 2015
Micro-optical design of a three-dimensional microlens scanner for vertically integrated micro-opto-electro-mechanical systemsMaciej Baranski, Sylwester Bargiel, Nicolas Passilly, et al.
Micromachines|February 25, 2023
Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible SubstratesFranz Selbmann, Soumya Deep Paul, Maulik Satwara, et al.
Micromachines|August 26, 2022
Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized CoilsChristian Hofmann, Maulik Satwara, Martin Kroll, et al.
Micromachines|November 9, 2018
Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression BondingKoki Tanaka, Wei-Shan Wang, Mario Baum, et al.
Pageof 1