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ACS Nano
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April 9, 2021
Recent Advancement of Emerging Nano Copper-Based Printable Flexible Hybrid Electronics
Zheng Li, Shuquan Chang, Saurabh Khuje, et al.
Nanoscale
|
November 2, 2023
Printing conformal and flexible copper networks for multimodal pressure and flow sensing
Saurabh Khuje, Abdullah Islam, Jian Yu, et al.
Nanoscale Advances
|
December 12, 2022
Surface-passivated Cu conductors for high-temperature sulfurous environments
Zheng Li, Jian Yu, Saurabh Khuje, et al.
Chemical Communications (Cambridge, England)
|
August 3, 2022
Molecular copper decomposition ink for printable electronics
Aaron Sheng, Abdullah Islam, Saurabh Khuje, et al.
ACS Nano
|
January 15, 2025
Hierarchical Biogenic-Based Thermal Insulation Foam
Taotao Meng, Long Zhu, Hannah Kriney, et al.
Nano Letters
|
October 28, 2021
Ultrahigh Temperature Copper-Ceramic Flexible Hybrid Electronics
Aaron Sheng, Saurabh Khuje, Jian Yu, et al.
Nanoscale Advances
|
September 22, 2022
Ductile cooling phase change material
Pratahdeep Gogoi, Zheng Li, Zipeng Guo, et al.
Proceedings of the National Academy of Sciences of the United States of America
|
October 20, 2020
A 3D-printed molecular ferroelectric metamaterial
Yong Hu, Zipeng Guo, Andrew Ragonese, et al.
Science Advances
|
September 29, 2021
Solution-shearing of dielectric polymer with high thermal conductivity and electric insulation
Zheng Li, Lu An, Saurabh Khuje, et al.
Proceedings of the National Academy of Sciences of the United States of America
|
June 13, 2022
Lithiating magneto-ionics in a rechargeable battery
Yong Hu, Weiyi Gong, Sichen Wei, et al.
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Search research articles
Search
Showing results (1-10 of 13) with videos related to
Sort By:
Page
of 2
ACS Nano
|
April 9, 2021
Recent Advancement of Emerging Nano Copper-Based Printable Flexible Hybrid Electronics
Zheng Li, Shuquan Chang, Saurabh Khuje, et al.
Nanoscale
|
November 2, 2023
Printing conformal and flexible copper networks for multimodal pressure and flow sensing
Saurabh Khuje, Abdullah Islam, Jian Yu, et al.
Nanoscale Advances
|
December 12, 2022
Surface-passivated Cu conductors for high-temperature sulfurous environments
Zheng Li, Jian Yu, Saurabh Khuje, et al.
Chemical Communications (Cambridge, England)
|
August 3, 2022
Molecular copper decomposition ink for printable electronics
Aaron Sheng, Abdullah Islam, Saurabh Khuje, et al.
ACS Nano
|
January 15, 2025
Hierarchical Biogenic-Based Thermal Insulation Foam
Taotao Meng, Long Zhu, Hannah Kriney, et al.
Nano Letters
|
October 28, 2021
Ultrahigh Temperature Copper-Ceramic Flexible Hybrid Electronics
Aaron Sheng, Saurabh Khuje, Jian Yu, et al.
Nanoscale Advances
|
September 22, 2022
Ductile cooling phase change material
Pratahdeep Gogoi, Zheng Li, Zipeng Guo, et al.
Proceedings of the National Academy of Sciences of the United States of America
|
October 20, 2020
A 3D-printed molecular ferroelectric metamaterial
Yong Hu, Zipeng Guo, Andrew Ragonese, et al.
Science Advances
|
September 29, 2021
Solution-shearing of dielectric polymer with high thermal conductivity and electric insulation
Zheng Li, Lu An, Saurabh Khuje, et al.
Proceedings of the National Academy of Sciences of the United States of America
|
June 13, 2022
Lithiating magneto-ionics in a rechargeable battery
Yong Hu, Weiyi Gong, Sichen Wei, et al.
Page
of 2