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Saurabh Khuje

Showing results (1-10 of 13) with videos related to

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ACS Nano|April 9, 2021
Recent Advancement of Emerging Nano Copper-Based Printable Flexible Hybrid ElectronicsZheng Li, Shuquan Chang, Saurabh Khuje, et al.
Nanoscale|November 2, 2023
Printing conformal and flexible copper networks for multimodal pressure and flow sensingSaurabh Khuje, Abdullah Islam, Jian Yu, et al.
Nanoscale Advances|December 12, 2022
Surface-passivated Cu conductors for high-temperature sulfurous environmentsZheng Li, Jian Yu, Saurabh Khuje, et al.
Chemical Communications (Cambridge, England)|August 3, 2022
Molecular copper decomposition ink for printable electronicsAaron Sheng, Abdullah Islam, Saurabh Khuje, et al.
ACS Nano|January 15, 2025
Hierarchical Biogenic-Based Thermal Insulation FoamTaotao Meng, Long Zhu, Hannah Kriney, et al.
Nano Letters|October 28, 2021
Ultrahigh Temperature Copper-Ceramic Flexible Hybrid ElectronicsAaron Sheng, Saurabh Khuje, Jian Yu, et al.
Nanoscale Advances|September 22, 2022
Ductile cooling phase change materialPratahdeep Gogoi, Zheng Li, Zipeng Guo, et al.
Proceedings of the National Academy of Sciences of the United States of America|October 20, 2020
A 3D-printed molecular ferroelectric metamaterialYong Hu, Zipeng Guo, Andrew Ragonese, et al.
Science Advances|September 29, 2021
Solution-shearing of dielectric polymer with high thermal conductivity and electric insulationZheng Li, Lu An, Saurabh Khuje, et al.
Proceedings of the National Academy of Sciences of the United States of America|June 13, 2022
Lithiating magneto-ionics in a rechargeable batteryYong Hu, Weiyi Gong, Sichen Wei, et al.
Pageof 2

Showing results (1-10 of 13) with videos related to

Sort By:
Pageof 2
ACS Nano|April 9, 2021
Recent Advancement of Emerging Nano Copper-Based Printable Flexible Hybrid ElectronicsZheng Li, Shuquan Chang, Saurabh Khuje, et al.
Nanoscale|November 2, 2023
Printing conformal and flexible copper networks for multimodal pressure and flow sensingSaurabh Khuje, Abdullah Islam, Jian Yu, et al.
Nanoscale Advances|December 12, 2022
Surface-passivated Cu conductors for high-temperature sulfurous environmentsZheng Li, Jian Yu, Saurabh Khuje, et al.
Chemical Communications (Cambridge, England)|August 3, 2022
Molecular copper decomposition ink for printable electronicsAaron Sheng, Abdullah Islam, Saurabh Khuje, et al.
ACS Nano|January 15, 2025
Hierarchical Biogenic-Based Thermal Insulation FoamTaotao Meng, Long Zhu, Hannah Kriney, et al.
Nano Letters|October 28, 2021
Ultrahigh Temperature Copper-Ceramic Flexible Hybrid ElectronicsAaron Sheng, Saurabh Khuje, Jian Yu, et al.
Nanoscale Advances|September 22, 2022
Ductile cooling phase change materialPratahdeep Gogoi, Zheng Li, Zipeng Guo, et al.
Proceedings of the National Academy of Sciences of the United States of America|October 20, 2020
A 3D-printed molecular ferroelectric metamaterialYong Hu, Zipeng Guo, Andrew Ragonese, et al.
Science Advances|September 29, 2021
Solution-shearing of dielectric polymer with high thermal conductivity and electric insulationZheng Li, Lu An, Saurabh Khuje, et al.
Proceedings of the National Academy of Sciences of the United States of America|June 13, 2022
Lithiating magneto-ionics in a rechargeable batteryYong Hu, Weiyi Gong, Sichen Wei, et al.
Pageof 2