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Journal of Nanoscience and Nanotechnology|July 20, 2016
Mechanical Properties and Fracture Behaviors of the As-Extruded Mg-5Al-3Ca Alloys Containing Yttrium at Elevated TemperatureHyeon-Taek Son, Yong-Ho Kim, Taek-Soo Kim, et al.Journal of Nanoscience and Nanotechnology|January 27, 2007
Fabrication of Mg2Si thermoelectric materials by mechanical alloying and spark-plasma sintering processChung-Hyo Lee, Seong-Hee Lee, Sung-Yong Chun, et al.Plant, Cell & Environment|December 31, 2009
Role of aquaporins in root water transport of ectomycorrhizal jack pine (Pinus banksiana) seedlings exposed to NaCl and fluorideSeong Hee Lee, Mónica Calvo-Polanco, Gap Chae Chung, et al.Journal of Nanoscience and Nanotechnology|January 24, 2020
The Effect of Mn and Ca Addition on the Microstructure and Mechanical Properties of the Al-Cu-Fe-Si-Zn Based AlloysHyo-Sang Yoo, Yong-Ho Kim, Seong-Hee Lee, et al.Journal of Nanoscience and Nanotechnology|April 22, 2018
Effect of Mn and AlTiB Addition and Heattreatment on the Microstructures and Mechanical Properties of Al-Si-Fe-Cu-Zr AlloyHyo-Sang Yoo, Yong-Ho Kim, Seong-Hee Lee, et al.Journal of Nanoscience and Nanotechnology|January 27, 2007
Annealing characteristics of nano-grained oxygen free copper processed by accumulative roll-bonding processSeong-Hee Lee, Chung Hyo Lee, Seung Zeon Han, et al.Journal of Nanoscience and Nanotechnology|July 20, 2016
Microstructural Evolution of a Nanostructured Complex Copper Alloy Processed by Accumulative Roll-Bonding of Oxygen Free Copper and DLPSeong-Hee Lee, Seong Ro Lee, In-Sook Ahn, et al.Journal of Nanoscience and Nanotechnology|December 1, 2007
Nanostructured bulk copper fabricated by accumulative roll bondingNaoki Takata, Seong-Hee Lee, Cha-Yong Lim, et al.Korean Journal of Audiology|March 22, 2014
Time course of the suppression effect on transient evoked otoacoustic emissions by prolonged contralateral acoustic stimulationHyun Woo Kang, Hyun Joon Shim, Seong Jun Song, et al.Journal of Nanoscience and Nanotechnology|December 1, 2007
Annealing characteristics of nanostructured Cu-Fe-P alloy processed by accumulative roll-bondingSeong-Hee Lee, Chung-Hyo Lee, Suk-Ja Yoon, et al.Pageof 5