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Nanomaterials (Basel, Switzerland)
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July 27, 2022
Selective Overview of 3D Heterogeneity in CMOS
Cheng Li, Zijin Pan, Xunyu Li, et al.
Micromachines
|
April 26, 2025
Interposer-Based ESD Protection: A Potential Solution for μ-Packaging Reliability of 3D Chips
Xunyu Li, Zijin Pan, Weiquan Hao, et al.
Nanomaterials (Basel, Switzerland)
|
April 28, 2023
Graphene-Based ESD Protection for Future ICs
Cheng Li, Zijin Pan, Weiquan Hao, et al.
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of 1
Search research articles
Search
Showing results (1-10 of 3) with videos related to
Sort By:
Page
of 1
Nanomaterials (Basel, Switzerland)
|
July 27, 2022
Selective Overview of 3D Heterogeneity in CMOS
Cheng Li, Zijin Pan, Xunyu Li, et al.
Micromachines
|
April 26, 2025
Interposer-Based ESD Protection: A Potential Solution for μ-Packaging Reliability of 3D Chips
Xunyu Li, Zijin Pan, Weiquan Hao, et al.
Nanomaterials (Basel, Switzerland)
|
April 28, 2023
Graphene-Based ESD Protection for Future ICs
Cheng Li, Zijin Pan, Weiquan Hao, et al.
Page
of 1