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Yu-An Shen

Showing results (1-10 of 11) with videos related to

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Materials (Basel, Switzerland)|July 27, 2022
Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder JointsYu-An Shen, John A Wu
Materials (Basel, Switzerland)|January 8, 2020
Anisotropic Grain Growth in (111) Nanotwinned Cu Films by DC ElectrodepositionTien-Lin Lu, Yu-An Shen, John A Wu, et al.
Scientific Reports|July 17, 2019
Suppressed Growth of (Fe, Cr<sub>,</sub> Co<sub>,</sub> Ni<sub>,</sub> Cu)Sn<sub>2</sub> Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu<sub>0.5</sub> Substrate during Solid-state AgingYu-An Shen, Chun-Ming Lin, Jiahui Li, et al.
Scientific Reports|July 24, 2020
Author Correction: Effect of FeCoNiCrCu<sub>0.5</sub> High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu SolderYu-An Shen, Chun-Ming Lin, Jiahui Li, et al.
Scientific Reports|January 9, 2023
Significant Hall-Petch effect in micro-nanocrystalline electroplated copper controlled by SPS concentrationYu-Jyun Kao, Yu-Ju Li, Yu-An Shen, et al.
Scientific Reports|March 8, 2019
Effect of FeCoNiCrCu<sub>0.5</sub> High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu SolderYu-An Shen, Chun-Ming Lin, Jiahui Li, et al.
Materials (Basel, Switzerland)|March 13, 2024
Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low TemperatureSiliang He, Jian Jiang, Yu-An Shen, et al.
Scientific Reports|April 22, 2021
Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methodsZhi Jin, Yu-An Shen, Yang Zuo, et al.
Nanotechnology|December 29, 2021
Nanotwin orientation on history-dependent stress decay in Cu nanopillar under constant strainYu-An Shen, Li Chang, Shou-Yi Chang, et al.
Materials (Basel, Switzerland)|March 29, 2023
Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid-Liquid System under Formic Acid AtmosphereSiliang He, Bifu Xiong, Fangyi Xu, et al.
Pageof 2

Showing results (1-10 of 11) with videos related to

Sort By:
Pageof 2
Materials (Basel, Switzerland)|July 27, 2022
Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder JointsYu-An Shen, John A Wu
Materials (Basel, Switzerland)|January 8, 2020
Anisotropic Grain Growth in (111) Nanotwinned Cu Films by DC ElectrodepositionTien-Lin Lu, Yu-An Shen, John A Wu, et al.
Scientific Reports|July 17, 2019
Suppressed Growth of (Fe, Cr<sub>,</sub> Co<sub>,</sub> Ni<sub>,</sub> Cu)Sn<sub>2</sub> Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu<sub>0.5</sub> Substrate during Solid-state AgingYu-An Shen, Chun-Ming Lin, Jiahui Li, et al.
Scientific Reports|July 24, 2020
Author Correction: Effect of FeCoNiCrCu<sub>0.5</sub> High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu SolderYu-An Shen, Chun-Ming Lin, Jiahui Li, et al.
Scientific Reports|January 9, 2023
Significant Hall-Petch effect in micro-nanocrystalline electroplated copper controlled by SPS concentrationYu-Jyun Kao, Yu-Ju Li, Yu-An Shen, et al.
Scientific Reports|March 8, 2019
Effect of FeCoNiCrCu<sub>0.5</sub> High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu SolderYu-An Shen, Chun-Ming Lin, Jiahui Li, et al.
Materials (Basel, Switzerland)|March 13, 2024
Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low TemperatureSiliang He, Jian Jiang, Yu-An Shen, et al.
Scientific Reports|April 22, 2021
Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methodsZhi Jin, Yu-An Shen, Yang Zuo, et al.
Nanotechnology|December 29, 2021
Nanotwin orientation on history-dependent stress decay in Cu nanopillar under constant strainYu-An Shen, Li Chang, Shou-Yi Chang, et al.
Materials (Basel, Switzerland)|March 29, 2023
Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid-Liquid System under Formic Acid AtmosphereSiliang He, Bifu Xiong, Fangyi Xu, et al.
Pageof 2