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Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints

Yu-An Shen1, John A Wu2

  • 1Department of Materials Science and Engineering, Feng Chia University, Taichung 407, Taiwan.

Materials (Basel, Switzerland)
|July 27, 2022
PubMed

Keywords:
Sn grain orientationSn orientation controlelectromigrationlead-free solderthermomechanical fatiguethermomigration

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