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Micromachines|December 31, 2025
AI-Assisted Composite Etch Model for MPTYanbin Gong, Fengsheng Zhao, Devin Sima, et al.Micromachines|December 31, 2025
Design of a Portable Nondestructive Instrument for Apple Watercore Grade Classification Based on 1DQCNN and Vis/NIR SpectroscopyHaijian Wu, Yong Lin, Wenbin Zhang, et al.Micromachines|December 31, 2025
Internal Temperature Measurement of Optically Levitated Particles in Vacuum by Raman ThermometryKou Li, Jiaming Liu, Xincai Xu, et al.Micromachines|December 31, 2025
Adaptive Fuzzy Fixed-Time Trajectory Tracking Control for a Piezoelectric-Driven MicroinjectorRungeng Zhang, Zehao Wu, Weijian Zhang, et al.Micromachines|December 31, 2025
A 3-Bit Low-Profile High-Gain Transmissive Intelligent Surface for Beam Focusing and Steering ApplicationsZaed S A Abdulwali, Majeed A S AlkanhalMicromachines|December 31, 2025
High-Precision Optical Angle Detection Method for Two-Dimensional MEMS MirrorsLongqi Ran, Yan Wang, Zhongrui Ma, et al.Micromachines|December 31, 2025
Post-Bonding Crack-Induced Di-Cantilever Bending (PBC-DCB): A Novel Method for Quantitative Evaluation of Bonding Strength for Wafer-to-Wafer and Die-to-Wafer Hybrid BondingTianze Zheng, Yuan Xu, Cong Mei, et al.Micromachines|December 31, 2025
An Effective Hybrid Rescheduling Method for Wafer Chip Precision Packaging Workshops in Complex Manufacturing EnvironmentsZiyue Wang, Weikang Fang, Yichen YangMicromachines|December 31, 2025
Simple Process for Flexible Light-Extracting QD Film and White OLEDEun Jeong Bae, Tae Jeong Hwang, Geun Su Choi, et al.Pageof 1,327