Ke Bai

4PUBLICATIONS
19CO-AUTHORS
MicroelectronicsElectrical energy transmission, networks and systemsMicro-manipulationFunctional materials
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Publications (4)

|Aug 10, 2022
Assembly of complex 3D structures and electronics on curved surfaces.

Zhaoguo Xue, Tianqi Jin, Shiwei Xu

|Apr 10, 2021
Rapidly deployable and morphable 3D mesostructures with applications in multimodal biomedical devices.

Fan Zhang, Shupeng Li, Zhangming Shen

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