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Daniel Josell

10PUBLICATIONS

7CO-AUTHORS

Circuits and systemsElectrical circuits and systemsMetals and alloy materialsHydrometallurgyMain group metal chemistry

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Publications (10)

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|Apr 20, 2023

Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology.

Thomas P Moffat, Trevor M Braun, David Raciti

|Feb 27, 2023

Extreme Bottom-up Gold Filling of High Aspect Ratio Features.

Daniel Josell, Thomas P Moffat

|Nov 23, 2020

Simulation of Copper Electrodeposition in Through-Hole Vias.

T M Braun, D Josell, J John

|Oct 12, 2020

Exploring the Limits of Bottom-Up Gold Filling to Fabricate Diffraction Gratings.

D Josell, S Ambrozik, M E Williams

|Oct 12, 2020

Accelerated Bottom-Up Gold Filling of Metallized Trenches.

D Josell, M E Williams, S Ambrozik

|Oct 12, 2020

Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias.

D Josell, L A Menk, A E Hollowell

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Frequent Collaborators

10 joint publications

Thomas P Moffat

3 joint publications

T M Braun

3 joint publications

A E Hollowell

2 joint publications

L A Menk

2 joint publications

S Ambrozik

1 joint publications

P D Yeh

1 joint publications

David Raciti

Frequent Collaborators

10 joint publications

Thomas P Moffat

3 joint publications

T M Braun

3 joint publications

A E Hollowell

2 joint publications

L A Menk

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