John Flake

9PUBLICATIONS
21CO-AUTHORS
Circuits and systemsElectrochemical energy storage and conversionElectrochemistryElectrical energy transmission, networks and systemsHydrometallurgy
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Publications (9)

|May 25, 2026
Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects.

|Oct 17, 2025
Anolyte Buffering and CO Coverage Effects in the Electrochemical Reduction of CO at Cu Electrocatalysts.

Mustapha Bello, Monsuru Olatunji Dauda, John Hendershot

|Sep 26, 2025
Highly Selective Electrolytic Reduction of CO2 to Ethylene.

Monsuru Olatunji Dauda, Mustapha Bello, John Hendershot

|Dec 18, 2024
Fundamental Insights into Copper-Epoxy Interfaces for High-Frequency Chip-to-Chip Interconnects.

Junghyun Park, Monsuru Dauda, Mustapha Bello

|Sep 03, 2021
CoCrFeNi High-Entropy Alloy as an Enhanced Hydrogen Evolution Catalyst in an Acidic Solution.

Frank McKay, Yuxin Fang, Orhan Kizilkaya

|Jun 16, 2021
Modifying Metastable Sr1-xBO3-δ (B = Nb, Ta, and Mo) Perovskites for Electrode Materials.

Tochukwu Ofoegbuna, Benjamin Peterson, Natalia da Silva Moura

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Frequent Collaborators

4 joint publications

Anthony Engler

4 joint publications

Junghyun Park

3 joint publications

Mustapha Bello

3 joint publications

Monsuru Olatunji Dauda