ATNet:用于DIP芯片的X射线图像的缺陷检测框架
Renbin Huang1, Daohua Zhan1, Xiuding Yang1
1School of Mechanical and Electrical Engineering, Guangdong University of Technology, Guangzhou 510006, China.
Micromachines
|July 29, 2023
概括
这项研究引入了一个新的深度学习模型,ATNet,用于使用X射线成像进行增强的芯片缺陷检测. ATNet显著提高了识别缺陷的准确性和速度,提高了生产质量.
科学领域:
- 人工智能的人工智能
- 计算机视觉 计算机视觉
- 材料科学 材料科学 材料科学
背景情况:
- 在质量控制中,X射线非破坏性成像对于芯片缺陷检测至关重要.
- 传统的缺陷检测算法与工业生产的高精度,速度和实时需求作斗争.
研究的目的:
- 开发一个先进的深度学习模型,用于准确和快速的芯片缺陷检测.
- 通过加强缺陷识别,提高芯片的生产质量和合格率.
主要方法:
- 提出了一种基于卷积神经网络的新型多级特征融合模块 (ATSPPF).
- 设计了一个深度学习模型 (ATNet) 结合ATSPPF模块用于芯片领先缺陷检测.
主要成果:
- 亚特网实现了高平均精度:mAP0.5为99.4%和mAP0.5-0.95为69.3%.
- 该模型以每秒146 (FPS) 运行,使用8.2千兆浮点运算 (GFLOP).
- 实现了近50%的检测速度,比基线 yolov5s.
结论:
- 拟议的ATNet模型有效地提取多层次的语义信息,用于更高级的芯片缺陷检测.
- ATNet为实时,高精度的工业芯片质量检查提供了一个有前途的解决方案.
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