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Microcracking in Concrete01:20

Microcracking in Concrete

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Microcracking in concrete refers to the tiny cracks that can form within the material even before any external load is applied. These microcracks typically occur at the interface between the coarse aggregate and the hydrated cement paste, often as a result of differential volume changes prompted by variations in stress-strain behavior, as well as thermal and moisture movement. Initially, these microcracks remain stable and do not grow substantially until the concrete is stressed to about 30...
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相关实验视频

Updated: Jun 29, 2025

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages
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微电子的现代趋势 包装 可靠性测试 测试

Emmanuel Bender1,2, Joseph B Bernstein2, Duane S Boning1

  • 1Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA 02142, USA.

Micromachines
|March 28, 2024
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概括
此摘要是机器生成的。

本综述总结了微电子包装可靠性趋势,从电线结合和BGA到先进的3D堆叠和互连织物集成以实现异质集成 (HI). 它探讨了设计和验证方法,为未来的HI包装挑战提出了优化测试的建议.

关键词:
风扇外包装的包装包装的可靠性 包装的可靠性可靠性预测预测的可靠性相互连接的织物织物球故障 球故障

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科学领域:

  • 微电子工程 微电子工程
  • 材料科学 材料科学 材料科学
  • 可靠性工程可靠性工程

背景情况:

  • 传统的微电子包装,包括线束和球网格阵列 (BGA),面临着越来越复杂的设备的限制.
  • 不同质整合 (HI) 方案需要新的包装解决方案来管理各种技术和性能要求.

研究的目的:

  • 提供对微电子包装可靠性的最新进展的全面概述.
  • 分析HI包装的新兴趋势,包括3D堆叠,插座和连接织物集成.
  • 为复杂的包装组件提出设计修改,设备验证和优化测试实践的策略.

主要方法:

  • 对当前和新兴的微电子包装技术的文献综述.
  • 对设计修改研究和包装设备验证方法的分析.
  • 探索确保先进包装组件兼容性的方法.

主要成果:

  • 详细回顾包装的演变,从线束/BGA到先进的HI技术.
  • 在复杂的HI方案中确定设计和验证的关键方法.
  • 探索新的包装组件的兼容性挑战和潜在解决方案.

结论:

  • 先进的包装技术,如3D堆叠和连接面料,对于未来的HI至关重要.
  • 优化测试方法对于应对即将到来的HI包装的可靠性挑战至关重要.
  • 为了成功实施复杂的微电子系统,需要积极的设计和验证策略.