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Failure characteristics of multiple-component fibrin-based adhesives
David H Sierra1, Alan W Eberhardt, Jack E Lemons
1Department of Biomedical Engineering, School of Engineering, Hoehn 370, University of Alabama at Birmingham, 35294, USA.
Journal of Biomedical Materials Research
|December 18, 2001
Summary
High fibrin concentration adhesives exhibit superior mechanical strength and fracture resistance compared to low concentration ones. Fibrin concentration significantly impacts adhesive failure modes and overall material properties.
Area of Science:
- Biomaterials Science
- Materials Engineering
- Tissue Engineering
Background:
- Fibrin-based adhesives are utilized in various medical applications.
- Understanding their mechanical properties and failure mechanisms is crucial for optimizing performance.
- The influence of fibrin concentration on these characteristics requires detailed investigation.
Purpose of the Study:
- To characterize the failure mechanisms of fibrin-based adhesives.
- To evaluate the effect of fibrin concentration (high vs. low) on mechanical properties.
- To compare failure modes under different testing conditions.
Main Methods:
- Uniaxial, monotonic tensile testing of bulk fibrin gels.
- Blister testing using porcine skin grafts as adherends.
- Analysis of failure characteristics at varying strain rates and fibrin concentrations.
Main Results:
- Fibrin gels exhibited strain hardening, with increased modulus of elasticity at higher strain rates.
- High fibrin concentration adhesives demonstrated greater ultimate tensile strength and modulus of elasticity.
- Failure modes shifted from cohesive to adhesive with increasing strain rate in high concentration gels.
Conclusions:
- Fibrin concentration significantly influences the mechanical properties and failure modes of fibrin-based adhesives.
- Higher fibrin concentrations lead to enhanced strength, stiffness, and fracture energy.
- Fibrin's behavior transitions from viscous to elastic with increasing concentration, impacting adhesive performance.