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A multichannel monolithic wireless microstimulator.

Khalil Najafi1, Maysam Ghovanloo

  • 1Center for Wireless Integrated Microsystems, Department of Electrical Engineering and Computer Science, University of Michigan, MI, USA.

Conference Proceedings : ... Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual Conference
|February 3, 2007
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A new wireless microstimulator chip and implant enable high-density neural stimulation for prosthetics. This system supports 2048 stimulation sites, offering advanced capabilities for neural prosthesis applications.

Area of Science:

  • Biomedical Engineering
  • Neuroscience
  • Electrical Engineering

Background:

  • Neural prostheses require high-density, controllable stimulation.
  • Existing systems face limitations in size, power, and channel count.

Purpose of the Study:

  • To develop a novel wireless microstimulator chip and implant for neural prostheses.
  • To achieve high-density stimulation with a modular and scalable architecture.

Main Methods:

  • Designed the Interestim-2B 64-site wireless current microstimulator chip.
  • Developed a prototype implant utilizing a modular stand-alone architecture.
  • Integrated off-chip components including an inductive-capacitive (LC) tank and silicon probes.
  • Implemented inductive power and data transfer at 2.5 Mb/sec.

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  • Utilized frequency shift keying for data transmission.

    • Main Results:

    • The system supports up to 2048 stimulation sites by connecting 32 chips in parallel.
    • The implant generates up to 65,800 stimulus pulses/sec.
    • Each chip features 16 current drivers with 270 microA full-scale current and 5-bit resolution.
    • Achieved a wide dynamic range extending within 150 mV of the 5 V supply rail.
    • The chip and implant possess compact dimensions (4.6 x 4.6 x 0.5 mm and 19 x 14 x 6 mm, respectively).

    Conclusions:

    • The developed microstimulator chip and implant offer a scalable and high-density solution for neural prosthesis applications.
    • The wireless, modular design facilitates integration and expansion for advanced neural interfaces.
    • This technology holds promise for improving the functionality of neuroprosthetic devices.