Related Experiment Video
Updated: Jun 26, 2026

06:48
Rapid Formation and Testing of Self-expanding NiTi Frames with a Small Form Factor Suitable for Minimally Invasive Implants
Published on: March 7, 2025
A simple method to treat an ingrowing toenail with a shape-memory alloy device
Masaya Ishibashi1, Nobuko Tabata, Takaki Suetake
1Dermatology Section, Sendai Red Cross Hospital, Sendai, Japan.
The Journal of Dermatological Treatment
|January 23, 2009
Summary
Ingrowing toenail treatment is improved with novel copper-aluminum-manganese shape-memory alloys (SMAs). These cost-effective SMAs offer an easy, effective, and painless solution for patients, representing a significant advancement.
Area of Science:
- Biomaterials Science
- Orthopedics
- Materials Engineering
Background:
- Ingrowing toenails lack a definitive treatment.
- Existing effective treatments are complex, while simple methods are less effective.
- A need exists for accessible and efficient ingrowing toenail therapies.
Purpose of the Study:
- To introduce an easy and effective treatment for ingrowing toenails.
- To evaluate the use of copper-aluminum-manganese-based shape-memory alloys (SMAs) for this purpose.
- To present a cost-effective alternative to existing treatments.
Main Methods:
- Utilizing Cu-Al-Mn-based shape-memory alloys (SMAs) with a specific characteristic shape.
- Patients can self-administer the device, allowing for easy detachment without pain.
- The corrective force of the SMAs was assessed for efficacy.
Main Results:
- Cu-Al-Mn-based SMAs provide an easy and effective method for ingrowing toenail treatment.
- The unique design allows for patient self-management and painless removal.
- Copper-based SMAs are significantly less expensive than nickel-titanium alloys.
Conclusions:
- Cu-Al-Mn-based SMAs offer a promising, low-cost alternative for ingrowing toenail management.
- This innovative approach simplifies treatment and improves patient compliance.
- While not universally applicable, it presents a viable option for many patients.

