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Related Concept Videos

Bus Impedance Matrix01:24

Bus Impedance Matrix

Calculating subtransient fault currents for three-phase faults in an N-bus power system involves using the positive-sequence network. When a three-phase short circuit occurs at a specific bus, the analysis uses the superposition method to evaluate two separate circuits.
In the first circuit, all machine voltage sources are short-circuited, leaving only the prefault voltage source at the fault location. The positive-sequence bus impedance matrix can be determined by solving the nodal equations,...
Semiconductors01:22

Semiconductors

There is variation in the electrical conductivity of materials - metals, semiconductors, and insulators that are showcased with the help of the energy band diagrams.
Metals such as copper (Cu), zinc (Zn), or lead (Pb) have low resistivity and feature conduction bands that are either not fully occupied or overlap with the valence band, making a bandgap non-existent. This allows electrons in the highest energy levels of the valence band to easily transition to the conduction band upon gaining...
Non-ohmic Devices00:51

Non-ohmic Devices

In most substances, the current flow is proportional to the voltage applied to it. A simple relationship between the values of current, voltage, and resistance is known as Ohm's law. Nonohmic devices do not exhibit a linear relationship between voltage and current. One such device is the semiconducting circuit element known as a diode. A diode is a circuit device that allows current flow in only one direction.
Consider a simple circuit consisting of a battery, a diode, and a resistor. A diode...
LC Circuits01:21

LC Circuits

An LC circuit consists of an inductor and a capacitor, either in series or parallel. Consider a charged capacitor connected with an inductor in series. Before the switch is closed, all the energy of the circuit is stored in the electric field of the capacitor. When the switch is closed, the capacitor begins to discharge, producing a current in the circuit. The current, in turn, creates a magnetic field in the inductor. Because of the induced emf in the inductor, the current cannot change...
Electronic Distance Measuring Instruments01:30

Electronic Distance Measuring Instruments

Electronic Distance Measuring Instruments (EDMs) are essential tools in modern surveying, offering precise distance measurements by emitting electromagnetic signals and calculating the time required for these signals to travel to a target and return. Two primary types of signals are used in EDMs — light waves and microwaves — each suited to specific environmental and distance requirements. Light-wave-based EDMs utilize either infrared or laser light, providing high accuracy over short distances...
Metal-Semiconductor Junctions01:24

Metal-Semiconductor Junctions

The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The semiconductor's...

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Related Experiment Video

Updated: Jun 8, 2026

Quasi-light Storage for Optical Data Packets
07:45

Quasi-light Storage for Optical Data Packets

Published on: February 6, 2014

Distributed optical data bus for board-level interconnects.

R K Kostuk, J H Yeh, M Fink

    Applied Optics
    |September 22, 2010
    PubMed
    Summary
    This summary is machine-generated.

    This study presents a scalable free-space optical system for board-level electronic interconnection. It demonstrates parallel data transfer using advanced optical components and achieves high performance with 64-bit data arrays.

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    Fiber Optic Distributed Sensors for High-resolution Temperature Field Mapping
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    Last Updated: Jun 8, 2026

    Quasi-light Storage for Optical Data Packets
    07:45

    Quasi-light Storage for Optical Data Packets

    Published on: February 6, 2014

    Fiber Optic Distributed Sensors for High-resolution Temperature Field Mapping
    09:48

    Fiber Optic Distributed Sensors for High-resolution Temperature Field Mapping

    Published on: November 7, 2016

    Area of Science:

    • Optoelectronics
    • Computer Engineering
    • Optical Interconnects

    Background:

    • Electronic processing elements require high-speed interconnections at the board level.
    • Current interconnect technologies face limitations in bandwidth and scalability.

    Purpose of the Study:

    • To design and demonstrate a distributed free-space optical system for board-level electronic processing element interconnection.
    • To enable scalable, parallel data transfer between multiple boards.

    Main Methods:

    • Utilized binary optic microlens arrays for light collimation and collection from surface-emitting lasers.
    • Employed substrate-mode holographic window elements for directing optical signals.
    • Incorporated a collection lens array to enhance alignment tolerance.

    Main Results:

    • Successfully demonstrated critical system components for free-space optical interconnects.
    • Achieved high-performance parallel data transfer using 64-bit data arrays.
    • The system design supports expansion beyond two boards.

    Conclusions:

    • The proposed free-space optical system offers a viable solution for scalable, high-bandwidth board-level interconnections.
    • The use of microlens arrays and holographic elements enables robust and efficient optical data transfer.