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Updated: Jun 8, 2026
06:53
Fabrication of Monolayer Graphene-Coated Grids for Cryoelectron Microscopy
Published on: September 8, 2023
Heat conduction across monolayer and few-layer graphenes
Yee Kan Koh1, Myung-Ho Bae, David G Cahill
1Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801, USA. mpekyk@nus.edu.sg
Nano Letters
|October 7, 2010
Summary
Thermal conductance across metal-graphene-insulator interfaces is significantly reduced due to interface thermal resistance. This impacts heat dissipation in graphene electronic devices.
Area of Science:
- Materials Science
- Solid State Physics
- Nanotechnology
Background:
- Graphene-based devices are promising for electronics due to their unique properties.
- Efficient thermal management is crucial for the performance and reliability of nanoscale electronic devices.
- Understanding thermal transport at interfaces is key to optimizing device design.
Purpose of the Study:
- To quantify the thermal conductance (G) of metal/graphene/insulator interfaces.
- To investigate the impact of graphene layers on thermal transport.
- To determine the primary heat transfer mechanism across these interfaces.
Main Methods:
- Fabrication of Au/Ti/graphene/SiO(2) interfaces with varying graphene layers (n=1-10).
- Measurement of thermal conductance using steady-state methods.
- Analysis of temperature dependence of thermal conductance (50-500 K).
Main Results:
- Achieved thermal conductance G ≈ 25 MW m(-2) K(-1) at room temperature.
- Observed a fourfold reduction in G compared to Au/Ti/SiO(2) interfaces, even with a single graphene layer (n=1).
- Identified series thermal resistance at both Au/Ti/graphene and graphene/SiO(2) interfaces as the cause.
Conclusions:
- Metal contacts and graphene layers significantly impede thermal dissipation in graphene devices.
- Phonon transport is the dominant heat transfer mechanism across these interfaces.
- Interface thermal resistance is a critical factor limiting electrical and thermal transport in submicrometer graphene electronics.
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