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Wafer cost analysis for a soft x-ray projection lithography system.

N M Ceglio¹, A M Hawryluk

¹University of California, Lawrence Livermore National Laboratory, P.O. Box 5508, Livermore, California 94550.

Journal of X-Ray Science and Technology

|February 11, 2011

Summary

Technical performance, not direct costs, critically impacts Soft X-Ray Projection Lithography (SXPL) economic viability. Key factors like mirror reflectivity are more vital for wafer exposure costs in SXPL systems.

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Area of Science:

Semiconductor manufacturing
Advanced lithography techniques
Economic analysis of technology

Background:

Soft X-Ray Projection Lithography (SXPL) is an advanced technique for semiconductor fabrication.
Assessing the economic viability of novel lithography systems is crucial for industry adoption.
Previous analyses may not have focused on a baseline cost breakdown for conventional SXPL.

Purpose of the Study:

To establish a baseline analysis of economic viability factors for Soft X-Ray Projection Lithography (SXPL).
To assess the relative importance of various cost factors within a conventional SXPL system.
To identify key performance parameters influencing wafer exposure costs.

Main Methods:

Development of a baseline model for SXPL system component costs.
Inclusion of performance specifications within the cost model.
Analysis of the dependence of wafer exposure cost on model elements.

Main Results:

Direct cost components, such as laser driver expenses, have a lesser impact on overall costs.
Technical performance parameters, specifically mirror reflectivity, significantly influence wafer exposure costs.
The model highlights critical areas for cost reduction and performance improvement in SXPL.

Conclusions:

Economic viability of SXPL is more sensitive to technical performance than direct capital costs.
Improving mirror reflectivity and other performance metrics is key to reducing SXPL wafer exposure costs.
This baseline analysis provides a foundation for future economic assessments of SXPL technology.