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Fabrication of nanostructured deoxidized low-phosphorous copper processed by three-layer stack accumulative
Seong-Hee Lee1, Hyoung-Wook Kim, Cha-Yong Lim
1Department of Advanced Materials Science and Engineering, Mokpo National University, Muan-gun 534-729, Chonnam, Korea.
Journal of Nanoscience and Nanotechnology
|April 2, 2011
Summary
Three-layer stack accumulative roll-bonding (ARB) effectively refines deoxidized low-phosphorous copper (DLPC) into an ultrafine grained structure. This process significantly enhances the material's tensile strength, making it a promising method for strengthening DLPC alloys.
Area of Science:
- Materials Science
- Metallurgy
- Nanotechnology
Background:
- Deoxidized low-phosphorous copper (DLPC) is a critical material in various industrial applications.
- Developing advanced processing techniques is essential for enhancing DLPC's mechanical properties.
Purpose of the Study:
- To investigate the microstructural evolution of DLPC processed by a three-layer stack accumulative roll-bonding (ARB) method.
- To analyze the impact of ARB cycles on the mechanical properties, specifically tensile strength and grain structure.
Main Methods:
- Fabrication of nanostructured DLPC using a three-layer stack ARB process.
- Microstructural analysis to observe grain size reduction and grain boundary evolution.
- Tensile testing to quantify changes in mechanical strength.
Main Results:
- Microstructure transformed from dislocation cells to ultrafine grains with increasing ARB cycles.
- Grain boundary spacing decreased significantly, reaching 170 nm after 7 cycles.
- Tensile strength increased approximately 2.5 times, reaching 600 MPa after 7 cycles.
- Fraction of high-angle grain boundaries increased to over 0.7 after 7 cycles.
Conclusions:
- The three-layer stack ARB process is highly effective for developing ultrafine grains in DLPC.
- This method provides significant strengthening of DLPC alloy, making it suitable for high-performance applications.
