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Graphene and boron nitride lateral heterostructures for atomically thin circuitry
Mark P Levendorf1, Cheol-Joo Kim, Lola Brown
1Department of Chemistry and Chemical Biology, Cornell University, Ithaca, New York 14853, USA.
Nature
|August 31, 2012
Summary
Researchers developed a novel
Area of Science:
- Materials Science
- Nanotechnology
- Condensed Matter Physics
Background:
- Precise spatial control of electrical properties in thin films is crucial for integrated circuitry.
- Large-scale production of graphene and hexagonal boron nitride (h-BN) exists, but controlled lateral heterostructures are challenging.
- Graphene/h-BN interfaces offer potential for bandgap and magnetic property engineering but lack scalable fabrication methods.
Purpose of the Study:
- To develop a versatile and scalable process for fabricating lateral junctions in atomically thin materials.
- To enable spatially controlled synthesis of graphene/h-BN and doped/undoped graphene lateral heterostructures.
- To advance the fabrication of atomically thin integrated circuitry.
Main Methods:
- Introduced a 'patterned regrowth' process for controlled synthesis of lateral junctions.
- Fabricated continuous, one-atom-thick sheets with distinct regions of graphene and h-BN, or doped and undoped graphene.
- Utilized conductance measurements to verify electrical properties across the heterojunctions.
Main Results:
- Successfully synthesized mechanically continuous lateral junctions between graphene and h-BN, and between doped and undoped graphene.
- Demonstrated insulating behavior in h-BN regions and excellent electrical properties (low resistance, high mobility) in graphene regions.
- Achieved spatially controlled fabrication of distinct electrical properties within a single atomically thin film.
Conclusions:
- The 'patterned regrowth' method provides a scalable route to creating lateral heterostructures in 2D materials.
- This technique enables the fabrication of electrically isolated active and passive elements within continuous, atomically thin sheets.
- The findings are a significant step towards developing complex, ultimate-limit thickness integrated devices.

