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Direct temperature mapping of nanoscale plasmonic devices
Boris Desiatov1, Ilya Goykhman, Uriel Levy
1Department of Applied Physics, The Benin School of Engineering and Computer Science, The Center for Nanoscience and Nanotechnology, The Hebrew University of Jerusalem , Jerusalem 91904, Israel.
Nano Letters
|January 16, 2014
Summary
Understanding heat distribution in silicon plasmonic nanotips is crucial due to joule heating. This study visualizes nanoscale thermal energy, showing a ~15°C temperature increase in the nanotip region.
Area of Science:
- Plasmonics
- Nanophotonics
- Thermal Engineering
Background:
- Plasmonic devices offer nanoscale light confinement but suffer from ohmic losses, causing significant joule heating.
- Understanding optical-induced heat generation and transport in integrated on-chip plasmonic devices is critical.
- There is a need for in situ visualization of electromagnetic-induced thermal energy distribution with high spatial resolution.
Purpose of the Study:
- To study the heat distribution in silicon plasmonic nanotips.
- To visualize electromagnetic-induced thermal energy distribution with high spatial resolution.
- To investigate the dynamics of heat transport in plasmonic nanostructures.
Main Methods:
- Numerical simulation of steady-state thermal distribution.
- Experimental measurement using scanning thermal microscopy.
- Numerical study of heat transport dynamics.
Main Results:
- A ~15°C temperature increase was observed in the nanotip region compared to ambient temperature under a 10 mW light source.
- Heat generation occurs due to light absorption in the metal surrounding the silicon nanotip.
- Significant heating is expected within picoseconds due to nanoscale dimensions.
Conclusions:
- In situ measurement of temperature distribution in plasmonic structures at the nanoscale is a powerful tool.
- This technique has potential applications in thermal plasmonics, nanochemistry, medicine, and data storage.
- The study highlights the importance of managing heat in plasmonic devices for future applications.
