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Updated: Apr 23, 2026
Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers
Published on: February 8, 2022
Released micromachined beams utilizing laterally uniform porosity porous silicon
Xiao Sun1, Adrian Keating2, Giacinta Parish3
1School of Mechanical and Chemical Engineering, University of Western Australia, 35 Stirling Hwy, Crawley, Western Australia 6009, Australia ; School of Electrical, Electronic and Computer Engineering, University of Western Australia, 35 Stirling Hwy, Crawley, Western Australia 6009, Australia.
Abstract:
Suspended micromachined porous silicon beams with laterally uniform porosity are reported, which have been fabricated using standard photolithography processes designed for compatibility with complementary metal-oxide-semiconductor (CMOS) processes. Anodization, annealing, reactive ion etching, repeated photolithography, lift off and electropolishing processes were used to release patterned porous silicon microbeams on a Si substrate. This is the first time that micromachined, suspended PS microbeams have been demonstrated with laterally uniform porosity, well-defined anchors and flat surfaces.
Pacs:
81.16.-c; 81.16.Nd; 81.16.Rf.
