Released micromachined beams utilizing laterally uniform porosity porous silicon
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Updated: Apr 23, 2026
Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers
Published on: February 8, 2022
Xiao Sun1, Adrian Keating2, Giacinta Parish3
1School of Mechanical and Chemical Engineering, University of Western Australia, 35 Stirling Hwy, Crawley, Western Australia 6009, Australia ; School of Electrical, Electronic and Computer Engineering, University of Western Australia, 35 Stirling Hwy, Crawley, Western Australia 6009, Australia.
Abstract:
Suspended micromachined porous silicon beams with laterally uniform porosity are reported, which have been fabricated using standard photolithography processes designed for compatibility with complementary metal-oxide-semiconductor (CMOS) processes. Anodization, annealing, reactive ion etching, repeated photolithography, lift off and electropolishing processes were used to release patterned porous silicon microbeams on a Si substrate. This is the first time that micromachined, suspended PS microbeams have been demonstrated with laterally uniform porosity, well-defined anchors and flat surfaces.
Pacs:
81.16.-c; 81.16.Nd; 81.16.Rf.
