Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding.

Area of Science:

• Materials Science
• Electrical Engineering
• Semiconductor Manufacturing

Background:

• Traditional quartz resonators often utilize ceramic-based packaging, which can present limitations in performance and integration.
• Advancements in semiconductor packaging technologies offer opportunities for improved resonator designs.

Purpose of the Study:

• To present a novel wafer-level packaging approach for quartz resonators using a silicon interposer.
• To evaluate the manufacturability and performance of this silicon-based package.

Main Methods:

• Development of a silicon-based package incorporating through-silicon via (TSV) interposers.
• Utilization of metal or polymer bonding for sealing frequency components.
• Implementation of three-dimensional (3D) core technologies including wafer thinning and copper TSVs.

Main Results:

• The proposed silicon-based package demonstrates excellent manufacturability.
• The advanced package exhibits superior performance characteristics compared to conventional methods.
• Successful integration of Cu TSVs and wafer thinning techniques.

Conclusions:

• The developed silicon-based package offers a viable and high-performing alternative to traditional ceramic-based packaging for quartz resonators.
• This approach leverages advanced 3D packaging technologies for enhanced resonator performance and integration.