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Microstructural and Process Characterization of Conductive Traces Printed from Ag Particulate Inks
David A Roberson1,2, Ryan B Wicker3,4, Lawrence E Murr5,6
1Department of Metallurgical and Materials Engineering, The University of Texas at El Paso, El Paso, TX 79968, USA. droberson@miners.utep.edu.
Materials (Basel, Switzerland)
|September 8, 2017
Summary
This study compares silver nanoparticle and microparticle conductive inks, finding nanoparticle inks offer more consistent electrical performance and better sintering. This is crucial for reliable printed electronics.
Area of Science:
- Materials Science
- Electrical Engineering
- Nanotechnology
Background:
- Conductive inks are essential for printed electronics fabrication.
- Understanding factors influencing their electrical performance is critical.
Purpose of the Study:
- To compare the electrical performance and microstructure of silver nanoparticle and microparticle conductive inks.
- To investigate the effect of thermal curing on ink resistivity and microstructure.
Main Methods:
- Morphological characterization of ink microstructures after thermal curing.
- Resistivity measurements of printed traces for both ink types.
- Analysis of the coefficient of variation (CV) in resistivity measurements.
Main Results:
- Microparticle inks showed higher resistivity variability (CV > 0.1) at higher resistivity values.
- Lower resistivity (1.4x bulk Ag) in microparticle inks resulted in CV < 0.1.
- Silver nanoparticle ink resistivity decreased with increased printed layers, enhancing sintering.
Conclusions:
- Silver nanoparticle inks demonstrate superior electrical consistency and sintering compared to microparticle inks.
- Optimizing printing layers is key to enhancing performance in nanoparticle-based conductive inks.
- These findings are vital for advancing reliable printed electronic devices.
