Cross-plane Thermoelectric and Thermionic Transport across Au/h-BN/Graphene Heterostructures

Nirakar Poudel1, Shi-Jun Liang2, David Choi3

  • 1Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, CA, 90089, USA. npoudel@usc.edu.

Scientific Reports
|October 28, 2017
PubMed
Summary

Researchers developed a new method to measure thermoelectric voltage at atomic interfaces using 2D materials. This technique revealed an interfacial Seebeck coefficient of -215 μV/K in gold/hexagonal boron nitride/graphene structures.