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Published on: June 3, 2015
Strain-Controlled Recombination in InGaN/GaN Multiple Quantum Wells on Silicon Substrates
Tao Lin1, Zhi Yan Zhou1, Yao Min Huang1
1School of Physical Science and Technology, Laboratory of Optoelectronic Materials and Detection Technology, Guangxi Key Laboratory for Relativistic Astrophysics,, Guangxi University, Nanning, 530004, China.
Releasing tensile stress in Indium Gallium Nitride/Gallium Nitride (InGaN/GaN) quantum wells significantly boosts light-emitting diode performance. Optimized structures achieved a 7x increase in external quantum efficiency, demonstrating improved InGaN/GaN material quality.
Area of Science:
- Materials Science
- Optoelectronics
- Semiconductor Physics
Background:
- Indium Gallium Nitride/Gallium Nitride (InGaN/GaN) multiple quantum wells (MQWs) are crucial for light-emitting diodes (LEDs).
- Growth on silicon substrates presents challenges due to lattice mismatch and thermal expansion differences, leading to strain.
- Controlling strain is vital for optimizing LED performance and reliability.
Purpose of the Study:
- To investigate the impact of tensile stress on the photoluminescence (PL) properties of InGaN/GaN MQW LEDs.
- To explore strain-controlled recombination mechanisms in LEDs grown on silicon.
- To enhance the external quantum efficiency (EQE) of InGaN/GaN LEDs through stress management.
Main Methods:
- Fabrication of InGaN/GaN MQW LEDs on silicon substrates with varying tensile stress-controlling architectures.
- Utilizing periodic Si delta-doping and InGaN/AlGaN layer insertion to modify strain.
- Characterization of photoluminescence (PL) properties, including external quantum efficiency (EQE) and recombination rates.
Main Results:
- Samples with released tensile stress exhibited significantly improved PL performance, with EQE reaching 17% (a 7-fold increase).
- Reduced non-radiative recombination rates ((2.5–2.8)×10⁻² s⁻¹) were observed in stress-released samples, correlating with better crystalline quality and fewer defects.
- More stable and higher radiative recombination rates ((5.7–5.8)×10⁻³ s⁻¹) at room temperature were attributed to the suppression of shallow localized states.
Conclusions:
- Tensile stress management is a key factor in enhancing InGaN/GaN MQW LED performance on silicon.
- Optimized strain engineering leads to reduced non-radiative recombination and improved radiative efficiency.
- The findings provide a pathway for developing high-efficiency LEDs on cost-effective silicon substrates.
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