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Efficiency Enhanced Grating Coupler for Perfectly Vertical Fiber-to-Chip Coupling.

Zan Zhang1, Xiaotao Shan1, Beiju Huang2

  • 1School of Electronic and Control Engineering, Chang'an University, Xi'an 710064, China.

Materials (Basel, Switzerland)
|June 18, 2020
PubMed
Summary

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This study introduces an improved bidirectional grating coupler using a silicon nitride layer for enhanced vertical fiber-to-chip coupling. The optimized design significantly boosts coupling efficiency and reduces back-reflection for Wavelength Division Multiplexing applications.

Area of Science:

  • Photonics
  • Nanotechnology
  • Materials Science

Background:

  • Efficient fiber-to-chip optical coupling is crucial for integrated photonic circuits.
  • Traditional grating couplers face limitations in efficiency and back-reflection.

Purpose of the Study:

  • To propose and optimize a bidirectional grating coupler for enhanced vertical coupling efficiency.
  • To reduce optical back-reflection into the fiber.
  • To achieve a cost-effective and wide-bandwidth solution for Wavelength Division Multiplexing (WDM) systems.

Main Methods:

  • A silicon nitride (Si3N4) layer was integrated above a uniform grating to enhance performance.
  • A genetic algorithm (GA) was employed for simultaneous optimization of the grating and Si3N4 layer.
  • A backside metal mirror was utilized to further improve coupling efficiency.
Keywords:
backside metal mirrorgrating couplerphotonic integrated circuitsilicon photonics

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Related Experiment Videos

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Main Results:

  • The optimized design achieved an average in-plane coupling efficiency of 68.5%, up from 57.5%.
  • Average back-reflection in the C band was reduced from 17.6% to 7.4%.
  • With a backside mirror, average and peak coupling efficiencies reached 87% and 89.4%, respectively. The device exhibits a 1-dB bandwidth of 64 nm and 3-dB bandwidth of 96 nm.

Conclusions:

  • The proposed grating coupler design offers a significant improvement in coupling efficiency and a reduction in back-reflection.
  • The design's minimum feature size (266 nm) allows for cost-effective fabrication using deep-UV lithography.
  • This technology provides an efficient and economical solution for vertical fiber-to-chip optical coupling in WDM applications.