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Micro-Hole Generation by High-Energy Pulsed Bessel Beams in Different Transparent Materials.
Valeria V Belloni1,2, Monica Bollani3, Shane M Eaton4
1Dipartimento di Scienza e Alta Tecnologia, Università degli Studi dell'Insubria, Via Valleggio 11, 22100 Como, Italy.
Micromachines
|April 30, 2021
Summary
This study demonstrates picosecond Bessel beam laser micromachining for creating precise through-apertures in transparent materials like glass and polymers. The technique offers efficient micro-drilling without scanning, producing features with micrometer-scale diameters.
Area of Science:
- Materials Science
- Optics and Photonics
- Manufacturing Engineering
Background:
- Laser micromachining of transparent dielectrics is crucial for various industrial applications.
- Traditional methods often require complex scanning mechanisms for depth control.
- Non-diffracting beams offer potential for simplified through-hole drilling.
Purpose of the Study:
- To investigate the efficacy of picosecond pulsed Bessel beams combined with trepanning for micro-drilling transparent materials.
- To evaluate the process on diverse dielectric samples with varying properties and thicknesses.
- To analyze the advantages and limitations of this technique across different materials.
Main Methods:
- Utilized a laser micromachining setup employing picosecond pulsed Bessel beams.
- Integrated the Bessel beam drilling with the trepanning technique for aperture generation.
- Applied the process to transparent dielectric materials including glass, polymers, and diamond.
- Analyzed generated through-holes for features, morphology, and aspect ratio.
Main Results:
- Successfully created through-apertures with diameters in the tens of micrometers.
- Demonstrated the capability to drill materials with thicknesses from 200 to 500 micrometers.
- Highlighted material-specific advantages and drawbacks, considering thermal and mechanical properties.
- Discussed optimization strategies for aperture quality, particularly at the output interface for glass.
Conclusions:
- Picosecond Bessel beam laser micromachining with trepanning is a viable method for creating micro-apertures in transparent dielectrics.
- The technique offers efficient, non-scanning drilling, adaptable to various materials and thicknesses.
- Material-dependent characteristics influence process outcomes, necessitating tailored approaches for optimal results.
