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Development of a Reliable High-Performance WLP for a SAW Device
1School of Electronic Science and Engineering, Xiamen University, Xiamen 361005, China.
Sensors (Basel, Switzerland)
|August 12, 2022
Summary
This study introduces advanced wafer-level packaging for surface acoustic wave (SAW) filters, enhancing long-term reliability and electrical performance. The new packaging technology ensures robust performance under stress, suitable for consumer electronics.
Area of Science:
- Materials Science
- Electrical Engineering
- Semiconductor Manufacturing
Background:
- Surface Acoustic Wave (SAW) filters are critical components in modern electronic devices.
- Existing packaging solutions often face challenges with long-term reliability and electrical performance.
- Wafer-level packaging (WLP) offers a potential solution for improved performance and miniaturization.
Purpose of the Study:
- To develop and present an advanced wafer-level packaging technology for SAW filters.
- To enhance the long-term reliability and electrical performance of SAW filters.
- To address key challenges in SAW filter packaging, such as delamination and collapse.
Main Methods:
- Development of cavity wall (CW) dam formation using laser drilling and non-photosensitive film vias.
- Fabrication of a redistribution layer (RDL) and ball-grid array (BGA).
- Finite element modeling (FEM) to analyze stress distribution in Cu RDL traces.
- Application of polymer coating to address delamination and use of high elastic modulus capping material to prevent collapse.
Main Results:
- The developed CW dam and roof layer polymer covering effectively solved the delamination problem.
- The SAW filter WLP demonstrated resistance to encapsulating pressure, resolving the collapse issue.
- Electrical performance testing showed no significant difference in insertion attenuation (<0.2 dB) after stress tests.
- The final packages successfully passed reliability tests for consumer electronics applications.
Conclusions:
- The presented wafer-level packaging technology significantly improves the reliability and electrical performance of SAW filters.
- This innovative packaging approach overcomes critical challenges, enabling robust performance in demanding environments.
- The technology is validated for use in consumer electronics, meeting stringent reliability standards.
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