Cutting of Diamond Substrate Using Fixed Diamond Grain Saw Wire

Area of Science:

• Materials Science
• Mechanical Engineering
• Nanotechnology

Background:

• Single-crystal diamond substrates are crucial in advanced technological applications.
• Precise cutting of diamond materials presents significant manufacturing challenges.
• Existing methods often lack the precision or efficiency required for intricate designs.

Purpose of the Study:

• To demonstrate a novel diamond-saw-wire cutting method for single-crystal diamond substrates.
• To develop and characterize a specialized diamond-grain saw wire for high-temperature applications.
• To establish the cutting performance and efficiency of the developed system.

Main Methods:

• Development of a unique saw-wire featuring diamond grains fixed with a high-melting-point bronze solder.
• Implementation of a specialized machine system incorporating a high-vacuum furnace and bronze solder with metallic compounds.
• Investigation of the cutting mechanism based on mild wear due to diamond-surface friction.

Main Results:

• A linear relationship was observed between cutting length and wire feed distance, approximated by y = 0.3622x (cutting depth y in μm, wire feed distance x in km).
• The saw wire demonstrated a lifespan exceeding 6000 km of wire feed under tested conditions (150 m/min speed, 1 N tension, 0.2 N cutting force).
• Single-crystal diamond substrates were successfully cut along designed lines exceeding 2 mm in length with a constant cutting speed of 0.36 μm/km.

Conclusions:

• The developed diamond-saw-wire cutting method is effective for precise fabrication of single-crystal diamond substrates.
• The specialized diamond-grain saw wire and machine system offer a viable solution for intricate diamond machining.
• The established cutting parameters and linear relationship provide a basis for optimizing future diamond cutting processes.