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Large Dense Periodic Arrays of Vertically Aligned Sharp Silicon Nanocones
Dirk Jonker1,2, Erwin J W Berenschot3, Niels R Tas3
1Mesoscale Chemical Systems, University of Twente, MESA+ Institute, P.O. Box 217, 7500 AE, Enschede, The Netherlands. d.jonker@utwente.nl.
Nanoscale Research Letters
|October 16, 2022
Summary
Researchers developed a novel method to create high-density silicon nanocones using ion beam etching and thermal oxidation. This technique produces precisely shaped, vertically aligned nanocones at wafer scale for advanced applications.
Area of Science:
- Materials Science
- Nanotechnology
- Semiconductor Physics
Background:
- Silicon nanocones are crucial for photovoltaics, nanofluidics, nanophotonics, and nanoelectronics.
- Fabrication of high-quality silicon nanocones requires advanced techniques.
Purpose of the Study:
- To present a novel wafer-scale fabrication method for high-density, high-aspect-ratio silicon nanocones.
- To achieve unprecedented homogeneity and precisely controlled apex radii for silicon nanocones.
Main Methods:
- Utilizing a top-down approach combining argon ion beam etching for pre-shaping silicon nanowires.
- Employing self-limited thermal oxidation for sharpening the pre-shaped nanowires into nanocones.
- Organizing nanocones in a square periodic lattice with 250 nm pitch.
Main Results:
- Fabrication of wafer-scale, vertically aligned, single-crystalline silicon nanocones with high density (1.6 billion/cm²).
- Achieved apex radii of curvature below 3 nm and minimal height variation (<5 nm for adjacent nanocones).
- Demonstrated unprecedented homogeneity across millimeter-scale arrays and wafer scale (<80 nm inhomogeneity).
Conclusions:
- The combined ion beam etching and thermal oxidation method offers precise control over silicon nanocone morphology.
- The method's applicability extends to other silicon micro- and nanowire fabrication processes.
- The high homogeneity and precise structure enable advanced applications in nano-scale device modeling and experimentation.

