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One-step curing process of conductive paste based on a UV pulse laser for a frequency selective surface
Applied Optics
|October 18, 2022
Summary
Ultraviolet (UV) pulse laser curing efficiently solidifies conductive paste for frequency selective surfaces (FSS) by controlling defocus. This method achieves strong bonding (peel strength > 7.1 N/cm) but requires longer curing times than continuous UV methods.
Area of Science:
- Materials Science
- Electrical Engineering
- Laser Processing
Background:
- Frequency Selective Surfaces (FSS) are crucial two-dimensional periodic structures often utilizing conductive paste and metal films.
- Efficient curing and material removal are key challenges in FSS fabrication.
- Existing methods may face limitations in precision and material integrity.
Purpose of the Study:
- To investigate the efficacy of ultraviolet (UV) pulse-laser-induced curing for conductive paste in FSS applications.
- To explore a method for simultaneous efficient curing and surplus material removal.
- To analyze the impact of laser parameters on conductive paste properties.
Main Methods:
- Utilized UV pulse laser with defocus control for irradiating conductive paste on FSS structures.
- Systematically studied the curing process by measuring Ohmic resistance and bonding force.
- Analyzed effects of varying conductive paste thickness and laser scanning parameters.
Main Results:
- Controllable defocusing of the UV pulse laser effectively solidified conductive paste, enabling electrical connections.
- Achieved a peel strength greater than 7.1 N/cm for the cured conductive paste.
- Identified that pulse laser curing requires a longer duration compared to continuous UV curing.
Conclusions:
- UV pulse laser curing with defocus control offers a viable method for fabricating FSS with improved conductive paste properties.
- The technique successfully balances curing efficiency with material integrity, preventing ablation.
- Further optimization may be needed to address the longer curing times for industrial scalability.
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