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Optical plasmonic sensing based on nanomaterials integrated in solid supports. A critical review
Annalisa Scroccarello1, Flavio Della Pelle1, Michele Del Carlo1
1Department of Bioscience and Technology for Food, Agriculture and Environment, University of Teramo, Campus "Aurelio Saliceti" via R. Balzarini 1, 64100, Teramo, Italy.
Analytica Chimica Acta
|November 28, 2022
Summary
Noble metal nanoparticles (MNPs) integrated into solid substrates offer advanced localized surface plasmon resonance (LSPR) biosensing. These mature analytical tools overcome colloidal limitations, enabling new integrated systems for point-of-need applications.
Area of Science:
- Nanotechnology
- Analytical Chemistry
- Materials Science
Background:
- Noble metal nanoparticles (MNPs) possess unique physicochemical properties crucial for sensing.
- Localized surface plasmon resonance (LSPR) of MNPs enables diverse analytical possibilities.
- Integrating MNPs into solid substrates enhances their stability and applicability.
Purpose of the Study:
- To review the scaling-up of MNPs from colloidal suspensions to solid substrates.
- To systematically analyze sensing and biosensing strategies based on LSPR changes on solid supports.
- To highlight the advancements in MNPs-based analytical tools for practical applications.
Main Methods:
- Literature review focusing on MNPs integrated into solid substrates (glass, polymers, cellulose).
- Systematic classification of sensing strategies based on LSPR changes.
- Analysis of MNPs synthesis, growth, etching, and displacement/aggregation mediated by analytes.
Main Results:
- MNPs integrated into solid substrates are mature analytical tools.
- These substrates overcome limitations associated with colloidal MNPs.
- New analytical opportunities arise for integrated systems and flexible devices.
Conclusions:
- MNPs-decorated/integrated substrates represent a significant advancement in plasmonic (bio)sensing.
- They pave the way for next-generation sensors for point-of-need applications.
- The integration enables realization of lab-on-chip/lab-on-strip and flexible devices.
