Search research articles

ABOUT JoVE

Overview Leadership Blog JoVE Help Center

AUTHORS

Publishing Process Editorial Board Scope & Policies Peer Review FAQ Submit

LIBRARIANS

Testimonials Subscriptions Access Resources Library Advisory Board FAQ

RESEARCH

JoVE Journal Methods Collections JoVE Encyclopedia of Experiments Archive

EDUCATION

JoVE Core JoVE Business JoVE Science Education JoVE Lab Manual Faculty Resource Center Faculty Site

Terms & Conditions of Use

Search research articles

Related Experiment Video

Updated: Jul 29, 2025

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh

Published on: June 23, 2017

Integration Technology of Micro-LED for Next-Generation Display.

Dingbo Chen¹, Yu-Chang Chen¹, Guang Zeng¹

¹State Key Laboratory of ASIC and System, Shanghai Institute of Intelligent Electronics & Systems, School of Microelectronics, Fudan University, Shanghai 200433, China.

Research (Washington, D.C.)

|May 24, 2023

Summary

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by

Same author

Reconfigurable Photoelectric Coaxial Fiber-Based Memristors for Neuromorphic Computing.

ACS nano·2026

Same author

Influence of Device Structure and Manufacturing Thermal Budget on Channel Release Module in GAA NSFET and Process Optimization.

Nanomaterials (Basel, Switzerland)·2026

Same author

Stress Engineering in the Optimization of Next-Generation Hafnium-Based Ferroelectric Memory.

Nanomaterials (Basel, Switzerland)·2026

Same author

IFN-γ-primed MSC extracellular vesicles attenuate rheumatoid arthritis via PD-L1-driven T-cell suppression and bone preservation.

Journal of controlled release : official journal of the Controlled Release Society·2026

Same author

Ultralow Power Optoelectronic Reconfigurable Hf<sub>0.2</sub>Zr<sub>0.8</sub>O<sub><i>x</i></sub>-Based Antiferroelectric Device for Adaptive Image Recognition.

ACS applied materials & interfaces·2026

Same author

Organic-assisted band engineering enables high-performance self-powered solar-blind 4H-SiC photodetectors.

Optics letters·2026

This review covers three key integration technologies for micro light-emitting diode (micro-LED) displays: transfer, bonding, and growth integration. These methods are crucial for creating advanced, large-scale, and full-color micro-LED displays.

Area of Science:

Materials Science
Electrical Engineering
Optoelectronics

Background:

III-V compound semiconductors are key for inorganic micro light-emitting diodes (micro-LEDs) used in self-emissive displays.
Integration technology is vital for micro-LED display advancement, enabling large-scale arrays and full-color integration.
Driving micro-LED displays requires integration with transistors or complementary metal-oxide-semiconductor circuits.

Purpose of the Study:

To review and summarize the three primary integration technologies for micro-LED displays.
To present an overview of the characteristics of each integration technology.
To discuss the strategies and challenges associated with integrated micro-LED display systems.

Main Methods:

Review of existing literature on micro-LED integration technologies.

More Related Videos

Production and Characterization of Vacuum Deposited Organic Light Emitting Diodes

Production and Characterization of Vacuum Deposited Organic Light Emitting Diodes

Published on: November 16, 2018

Development of Efficient OLEDs from Solution Deposition

Development of Efficient OLEDs from Solution Deposition

Published on: November 4, 2022

Related Experiment Videos

Last Updated: Jul 29, 2025

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh

Published on: June 23, 2017

Production and Characterization of Vacuum Deposited Organic Light Emitting Diodes

Production and Characterization of Vacuum Deposited Organic Light Emitting Diodes

Published on: November 16, 2018

Development of Efficient OLEDs from Solution Deposition

Development of Efficient OLEDs from Solution Deposition

Published on: November 4, 2022

Categorization of integration methods into transfer, bonding, and growth integration.

Analysis of the features, strategies, and challenges of each method.

Main Results:

Identification and description of transfer integration, bonding integration, and growth integration as the main technologies.
Overview of the distinct characteristics and applications of each integration approach.
Discussion of the current challenges and future directions in micro-LED integration.

Conclusions:

Transfer, bonding, and growth integration are the fundamental technologies for micro-LED display development.
Each integration method presents unique advantages and challenges that influence display performance and scalability.
Further advancements in integration technologies are essential for realizing the full potential of micro-LED displays.