Additive Manufacturing of Multimaterial Composites for Radiation Shielding and Thermal Management
Devon Beck1, Jacob Bickus1,2, Ethan Klein2
1Massachusetts Institute of Technology Lincoln Laboratory, Lexington, Massachusetts 02421-6426, United States.
ACS Applied Materials & Interfaces
|June 8, 2023
Summary
This study introduces a new method for creating radiation shielding for electronics using 3D printing. The custom composite materials can protect against various radiation types, enhancing the durability of space systems.
Area of Science:
- Materials Science
- Aerospace Engineering
- Nanotechnology
Background:
- Space radiation poses a significant threat to microelectronic systems, causing degradation and malfunction.
- Existing radiation shielding methods are often limited to single radiation types or require costly radiation-hardened components.
- There is a need for advanced shielding solutions that are adaptable and effective against diverse radiation environments.
Purpose of the Study:
- To develop a novel fabrication strategy for multimaterial radiation shielding.
- To demonstrate the efficacy of direct ink writing for creating custom radiation shielding composites.
- To explore the potential for enhanced thermal management in radiation shields.
Main Methods:
- Utilized direct ink writing (DIW) to manufacture composite materials.
- Fabricated custom composites using tungsten and boron nitride.
- Investigated shear-induced alignment of anisotropic boron nitride flakes during printing.
Main Results:
- The additively manufactured shields demonstrated the ability to attenuate multiple species of radiation.
- Tailoring the composition and architecture of the printed composites allowed for customized shielding properties.
- Boron nitride flake alignment during printing facilitated effective thermal management.
Conclusions:
- The developed generalized method offers a promising approach for protecting commercial microelectronic systems from radiation damage.
- This fabrication strategy can significantly enhance the capabilities and longevity of future satellites and space systems.
- The ability to tailor shielding properties and incorporate thermal management presents a versatile solution for space electronics protection.
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