Augmented Incremental Potential Contact for Sticky Interactions.

Area of Science:

• Solid Mechanics
• Computational Physics
• Material Science

Background:

• Simulating elastoplastic solids with adhesion is computationally challenging.
• Existing methods often lack robustness for complex geometries and material behaviors.
• The Incremental Potential Contact (IPC) solver offers a promising foundation but requires extensions for adhesion.

Purpose of the Study:

• To develop a variational formulation for simulating sticky interactions in elastoplastic solids.
• To extend the Incremental Potential Contact (IPC) solver to incorporate advanced adhesion models.
• To enable robust and user-friendly simulation of complex contact phenomena.

Main Methods:

• Augmenting the IPC solver with the Raous-Cangemi-Cocou (RCC) adhesion model.
• Introducing a physically parametrized normal adhesion formulation based on unsigned distance.
• Proposing a smoothly clamped tangential adhesion model for debonding simulation.

Main Results:

• Robust simulation of sticky interactions for arbitrary codimensional geometries (0, 1, and 2).
• Accurate modeling of complex adhesion behaviors, including debonding.
• Demonstrated efficacy through benchmark studies against classical models and experimental data.

Conclusions:

• The proposed variational formulation significantly enhances the capabilities of the IPC solver for elastoplastic adhesion.
• The new method provides a robust and controllable approach for simulating intricate contact scenarios.
• This work advances the simulation of material interactions in solid mechanics.