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Numerical Simulation of Deformation in Hot Runner Manifold
Jae Sung Jung1, Sun Kyoung Kim1
1Department of Mechanical System Design Engineering, Seoul National University of Science and Technology, Seoul 01811, Republic of Korea.
Abstract:
This study simulated the deformation of a hot runner manifold and nozzle assembly during operation, aiming to address potential leaks and premature failure. Both thermal and mechanical models were used simultaneously to accurately capture system behavior. A simplified set of boundary conditions was proposed for efficient problem-solving. Analysis of the simulation results revealed that thermal deformation posed a risk of catastrophic failures and leaks. Deformation from melt pressure was relatively small compared to thermal loading, not exceeding 12%. The study provided design recommendations based on the simulation findings, guiding the development of hot runner systems for improved reliability.
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