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Uncooled Mid-Infrared Sensing Enabled by Chip-Integrated Low-Temperature-Grown 2D PdTe2 Dirac Semimetal
Longhui Zeng1, Wei Han2, Xiaoyan Ren3
1Department of Electrical and Computer Engineering, University of California San Diego, La Jolla, California 92093, United States.
Nano Letters
|August 18, 2023
Summary
Researchers developed inch-level 2D palladium ditelluride (PdTe₂) using low-temperature epitaxy for uncooled mid-infrared (MIR) imaging. This breakthrough enables high-resolution MIR sensing and optical communication without external cooling.
Area of Science:
- Materials Science
- Condensed Matter Physics
- Nanotechnology
Background:
- Next-generation mid-infrared (MIR) imaging requires free-cooling and high integration capabilities.
- Two-dimensional (2D) semimetals offer promising infrared (IR) photoresponses but face challenges in scalable growth and on-chip integration.
Purpose of the Study:
- To demonstrate scalable, low-temperature growth of 2D semimetals for uncooled MIR sensing.
- To develop integrated MIR photodetectors and imaging arrays using 2D materials.
Main Methods:
- Utilized a low-temperature self-stitched epitaxy (SSE) approach to grow inch-level 2D palladium ditelluride (PdTe₂).
- Fabricated on-chip PdTe₂/Si Schottky junction photodetectors and integrated device arrays.
- Investigated the ultrabroadband photoresponse and imaging capabilities of the fabricated devices.
Main Results:
- Achieved inch-level continuous 2D PdTe₂ films via low-temperature SSE (∼300 °C), compatible with back-end-of-line technology.
- Demonstrated uncooled on-chip photodetectors with ultrabroadband photoresponse up to 10.6 μm and high specific detectivity.
- Showcased high-resolution room-temperature imaging capability with integrated device arrays.
Conclusions:
- The SSE method enables low-temperature, scalable growth of 2D semimetals for advanced IR applications.
- Developed functional uncooled MIR photodetectors and imaging systems for sensing and optical communication.
- Paved the way for 2D materials in uncooled MIR sensing and integrated photonic devices.
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