Advanced multifunctional IGBT packing materials with enhanced thermal conductivity and electromagnetic wave...

Insulated-Gate Bipolar Transistors (IGBT) face limitations in high-frequency electronic applications due to heat accumulation and electromagnetic interference issues. To address these challenges, it is crucial to develop packing materials with excellent electromagnetic interference immunity and heat dissipation properties. In this research, a novel epoxy-based packing material (MDCF@C-ZrO₂/EP) with high electromagnetic wave absorption and exceptional thermal transport properties was produced by employing a unique three-dimensional carbon structure-induced nanomaterial dispersion strategy. In particular, the three-dimensional MDCF structure effectively prevents packing agglomeration and fosters the formation of an abundant hetero-interface between MDCF and C-ZrO₂, leading to improved impedance matching and enhanced electromagnetic wave dissipation capabilities. Remarkably, even at a mere 5 wt% filling level, the material demonstrates an impressive reflection loss value of -58.92 dB and a wide effective absorption bandwidth of 6.68 GHz, effectively covering the entire Ku-band. Additionally, the 3D MDCF@C-ZrO2 significantly enhances the phonon transport path and elevates the thermal conductivity of pure epoxy resin by an impressive ∼ 150%. As a result, this innovative research holds tremendous potential in enabling the application of IGBTs in high-power and high-frequency electronic components, while also contributing to the advancement of next-generation wireless communications and smart devices.