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Modern Trends in Microelectronics Packaging Reliability Testing

Emmanuel Bender1,2, Joseph B Bernstein2, Duane S Boning1

  • 1Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA 02142, USA.

Micromachines
|March 28, 2024
PubMed

Keywords:
fan-out packagingpackaging reliabilityreliability predictionsilicon interconnect fabricsolder ball failure

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