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Updated: Jun 27, 2025

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
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Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Yongkun Wang1, Haozheng Liu1, Linghua Huo1

  • 1State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi'an 710071, China.

Micromachines
|April 27, 2024
PubMed

Keywords:
TSVadvanced packagingmicro-bumpmulti-field coupling

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