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Updated: Jun 23, 2025

Electrospray Deposition of Uniform Thickness Ge23Sb7S70 and As40S60 Chalcogenide Glass Films
Published on: August 19, 2016
Exploring the evolution of mass density and thickness of N-doped Ge-rich GeSbTe during multistep crystallization
Jacopo Remondina1, Alain Portavoce1, Yannick Le Friec2
1Aix Marseille Univ, CNRS, IM2NP, Marseille, France.
Abstract:
Among phase change materials, Ge-rich GeSbTe alloys (GGST) are key alloys for the next generation of embedded phase change memories because of their good thermal stability, allowing their use for the automotive applications. Several studies have investigated GGST crystallization, which takes place in several stages, including phase separation in the amorphous material, the crystallization of the cubic Ge and GST phases before a complete crystallization for higher thermal budget. So far, however, no information is available on the possible changes in density and thickness of such alloys. This paper investigates such variations in density and thickness for a N-doped GGST layer (GGSTN) during isothermal annealing, following the four main stages of its multistep crystallization process. X-ray reflectivity (XRR) and X-ray diffraction were employed for analysis. The study reveals that density and thickness exhibit distinct changes during crystallization, with density increasing by approximately 9% during transition from amorphous to crystalline states. These changes are attributed to alterations in layer morphology, particularly at the Ge crystallization temperature and at the onset of GST crystal formation. Additionally, at high thermal budgets, discrepancies between XRR analysis methods suggest the formation of a thin, lower density layer near the top interface of the GGSTN layer. These results provide insights into the structural evolution of the GGSTN layer, which is crucial for phase change random access memory applications.
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