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Updated: Jun 22, 2025

Synchrotron X-ray Microdiffraction and Fluorescence Imaging of Mineral and Rock Samples
Published on: June 19, 2018
Simultaneous mapping of cathodoluminescence spectra and backscatter diffraction patterns in a scanning electron
Paul R Edwards1, G Naresh Kumar1,2, Jonathan J D McKendry3
1Department of Physics, SUPA, University of Strathclyde, 107 Rottenrow, Glasgow G4 0NG, United Kingdom.
We developed a new method for simultaneously acquiring electron backscatter diffraction and cathodoluminescence signals from semiconductor films. This technique allows for detailed strain analysis and light emission characterization in micro-LEDs.
Area of Science:
- Materials Science
- Solid State Physics
- Optoelectronics
Background:
- Electron backscatter diffraction (EBSD) and cathodoluminescence (CL) are key scanning electron microscopy (SEM) techniques for semiconductor film characterization.
- EBSD reveals crystalline material strain, while CL shows strain's effect on light emission.
- Traditional methods face geometric conflicts, preventing simultaneous EBSD and CL data acquisition.
Purpose of the Study:
- To present a novel method for simultaneous EBSD and CL signal acquisition.
- To enable combined strain and light emission analysis in semiconductor materials.
- To investigate strain fields and emission wavelength variations in deep-ultraviolet micro-LEDs.
Main Methods:
- Developed a technique to collect CL signals through a transparent sample substrate during SEM.
- Integrated EBSD and CL acquisition within a single scanning process.
- Applied the combined technique to analyze strain and emission in deep-ultraviolet micro-LEDs.
Main Results:
- Successfully achieved simultaneous EBSD and CL data collection from semiconductor samples.
- Demonstrated the ability to map strain distribution and correlated emission wavelength variations.
- Validated the technique's effectiveness on deep-ultraviolet micro-LEDs.
Conclusions:
- The presented method overcomes geometric limitations for combined EBSD and CL analysis.
- Simultaneous acquisition avoids image alignment issues and minimizes beam damage.
- This approach offers a powerful tool for characterizing strain-dependent optoelectronic properties in semiconductor devices.
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