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Highly Robust, Pressureless Silver Sinter-Bonding Technology Using PMMA Combustion for Power Semiconductor
Moses Gu1, Hyunjin Nam2, Sehoon Park2
1Intelligent Semiconductor Engineering Department, Seoul National University of Science and Technology, 232, Gongneung-ro, Nowon-gu, Seoul 01811, Republic of Korea.
Materials (Basel, Switzerland)
|November 9, 2024
Summary
This study developed a robust, pressureless silver sinter-bonding technique for power semiconductors using bimodal silver paste and PMMA. The optimized process achieves high shear strength and void-free joints, crucial for reliable high-temperature applications.
Area of Science:
- Materials Science and Engineering
- Semiconductor Packaging Technology
Background:
- Traditional bonding methods for power semiconductors face challenges with high temperatures and stresses.
- Need for advanced joining techniques to ensure reliability and performance in demanding applications.
Purpose of the Study:
- To develop a novel, pressureless silver sinter-bonding technology for power semiconductor packaging.
- To investigate the influence of sintering parameters and additives on joint integrity and mechanical properties.
Main Methods:
- Utilized a bimodal silver paste (nanoparticles and sub-micron particles) with polymethyl methacrylate (PMMA) additive.
- Systematically studied the effects of sintering temperature (up to 350 °C) and PMMA content (optimal at 5 wt.%) on shear strength and microstructure.
- Analyzed void formation and particle necking through microstructural examination.
Main Results:
- Achieved a maximum shear strength of 41 MPa at 300 °C with minimal voids, attributed to PMMA-enhanced necking.
- Observed a decrease in shear strength to 35 MPa at 350 °C due to substrate interface issues (cracks, voids) from thermal expansion mismatch.
- Identified 5 wt.% PMMA as optimal for balancing thermal energy release and void minimization.
Conclusions:
- The developed pressureless silver sintering technology offers a robust and void-free joining solution.
- Demonstrates significant potential for high-reliability power semiconductor modules operating under extreme conditions.
- PMMA additive plays a critical role in facilitating rapid, high-strength sinter-bonding.
