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Adrià Grabulosa1, Johnny Moughames1, Xavier Porte1

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Researchers developed a novel 3D printing method combining one and two-photon polymerization for faster fabrication of integrated photonic circuits. This technique significantly enhances optical confinement and reduces fabrication time for advanced electronic devices.

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Area of Science:

  • Optoelectronics and Photonics
  • Materials Science and Engineering
  • Additive Manufacturing

Background:

  • High-performance electronic integration faces limitations due to 2D lithography and thermal dissipation challenges.
  • Three-dimensional (3D) photonic integration is crucial for scalable, application-specific integrated circuits, particularly for neural networks.
  • Direct laser writing, specifically two-photon polymerization (TPP), is a promising CMOS-compatible technique for high-resolution 3D photonic integration.

Purpose of the Study:

  • To develop a novel, accelerated fabrication process for 3D photonic integration by combining one-photon polymerization (OPP) and TPP.
  • To enhance optical confinement and reduce fabrication time for 3D photonic circuits.
  • To demonstrate the performance and stability of waveguides fabricated using the new method.

Main Methods:

  • Introduced a hybrid (3 + 1)D "flash"-TPP technique combining femtosecond TPP for waveguide cores and support structures with UV-initiated OPP for passive volumes.
  • Optimized voxel spacing during TPP for smooth interfaces (cores) and rapid printing (supports).
  • Utilized UV blanket irradiation for rapid polymerization of the entire chip's passive volume, decoupling fabrication time from volume size.

Main Results:

  • Successfully fabricated vertical single-mode waveguides with lengths up to 6 mm and numerical apertures (NA) of 0.16.
  • Achieved low injection losses (-0.26 dB) and propagation losses (-1.36 dB/mm at 660 nm), comparable to silicon photonics.
  • Demonstrated long-term optical performance stability (>3000 h post-printing) and operational stability (600 h continuous use).

Conclusions:

  • The combined OPP and TPP approach significantly accelerates 3D photonic circuit fabrication while improving optical confinement.
  • The fabricated waveguides exhibit high performance metrics and excellent long-term stability, suitable for advanced photonic applications.
  • This method offers a scalable and efficient pathway for realizing complex 3D integrated photonic devices for emerging technologies like neural networks.