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Related Concept Videos

Schottky Barrier Diode01:27

Schottky Barrier Diode

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Schottky barrier diodes are specialized semiconductor devices characterized by their unique construction. This construction involves combining a metal layer with a moderately doped n-type semiconductor material. This combination leads to the formation of a Schottky barrier, a pivotal element that defines the diode's operational characteristics. The core functionality of Schottky barrier diodes is their capacity to allow current to flow in only one direction due to their distinctive...
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MOSFET: Enhancement Mode01:22

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Enhancement-mode MOSFETs are pivotal components in electronics, distinguished by their capacity to act as highly efficient switches. They are part of the larger family of metal-oxide Semiconductor Field-Effect Transistors (MOSFETs). They are available in two types: p-channel and n-channel, each tailored to specific polarity operations.
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The operation of a p-n junction diode involves various biasing conditions, including forward bias, reverse bias, and equilibrium.
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MOSFET: Depletion Mode01:20

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Depletion-mode MOSFETs represent a unique subset of MOSFET technology, functioning fundamentally differently from their enhancement-mode counterparts. Unlike enhancement MOSFETs, which require a positive gate-source voltage (Vgs) to turn on, depletion-mode MOSFETs are inherently conductive and "normally on" devices.
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Clamper Circuit01:14

Clamper Circuit

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A clamper circuit, also known as a DC restorer, represents a specialized variant of the rectifier circuit, notable for its method of taking the output across the diode rather than the capacitor. This configuration lends to several distinctive applications, particularly in handling square wave inputs.
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Voltage Doubler Circuit01:23

Voltage Doubler Circuit

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A voltage doubler circuit integrates two main components: a clamping section and a rectifier section. The clamping section consists of a capacitor (C1) and a diode (D1), whereas the rectifier section is equipped with another diode (D2) and capacitor (C2). This circuit produces an output voltage with twice the amplitude of the sinusoidal input voltage.
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Reducing Avalanche Build-Up Time by Integrating a Single-Photon Avalanche Diode with a BiCMOS Gating Circuit.

Bernhard Goll1, Mehran Saadi Nejad1, Kerstin Schneider-Hornstein1

  • 1Institute of Electrodynamics, Microwave and Circuit Engineering, TU Wien, Gusshausstrasse 25/E354-02, A-1040 Wien, Austria.

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|December 17, 2024
PubMed
Summary

Integrating a single-photon avalanche diode (SPAD) with a BiCMOS gating circuit on-chip significantly reduces avalanche build-up time. This chip-level integration minimizes parasitic capacitance, improving SPAD performance for faster photon detection.

Keywords:
BiCMOSCMOSSPADavalanche transientsgating circuitsingle-photon avalanche diode

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Area of Science:

  • Photonics
  • Integrated Circuits
  • Semiconductor Devices

Background:

  • Single-photon avalanche diodes (SPADs) are crucial for sensitive light detection.
  • Parasitic capacitance in SPAD circuits can limit performance, particularly avalanche build-up time.
  • Traditional SPAD designs often involve off-chip gating circuits, introducing bondpad capacitance.

Purpose of the Study:

  • To investigate the impact of integrating a SPAD with a BiCMOS gating circuit on a single chip.
  • To quantify the reduction in avalanche build-up time achieved through this integration.
  • To compare the performance of an integrated BiCMOS gating circuit with a standard CMOS gating circuit.

Main Methods:

  • Fabrication of an integrated SPAD and BiCMOS gating circuit using a 0.35 μm CMOS process extended with an NPN transistor module.
  • Measurement of gating voltage transients using an integrated mini-pad and a picoprobe.
  • Comparison of avalanche build-up times between the integrated BiCMOS SPAD and an off-chip wire-bonded SPAD.

Main Results:

  • On-chip integration eliminated bondpad capacitance, a significant contributor to parasitic capacitance.
  • The integrated BiCMOS gating circuit reduced SPAD avalanche build-up time to 1.6 ns.
  • This represents approximately a twofold improvement compared to ~3 ns for an off-chip wire-bonded SPAD.

Conclusions:

  • Chip-level integration of SPADs and BiCMOS gating circuits effectively minimizes parasitic capacitance.
  • This approach substantially reduces avalanche build-up time, enhancing SPAD operational speed.
  • The developed BiCMOS technology enables faster and more efficient single-photon detection systems.