Laser-Induced Nanowire Percolation Interlocking for Ultrarobust Soft Electronics.

Area of Science:

• Materials Science
• Nanotechnology
• Soft Electronics

Background:

• Metallic nanowires offer excellent mechanical compliance and electrical properties for soft electronics.
• Weak adhesion and low robustness of nanowire networks limit their reliability and applications.
• Existing methods often require insulating protective layers, restricting utility.

Purpose of the Study:

• To develop a versatile laser-based process for strong adhesion and mechanical robustness of nanowire networks on diverse substrates.
• To eliminate the need for protective insulating layers in nanowire-based devices.
• To demonstrate the broad applicability and enhanced performance of the laser-induced interlocking mechanism.

Main Methods:

• Utilizing laser-induced photothermal energy at the nanowire-substrate interface.
• Facilitating interpenetration between the nanowire network and the polymer matrix.
• Achieving mechanical interlocking through percolation for enhanced adhesion and robustness.

Main Results:

• Demonstrated strong adhesion and mechanical robustness of metallic nanowire networks on various substrates without protective layers.
• Showcased the broad applicability across different metallic nanowires and thermoplastic substrates.
• Validated the enhanced robustness in reusable wearable physiological sensors and stable functionalization of conducting polymers in wet environments.

Conclusions:

• The laser-based process offers a generalized and versatile method for improving nanowire network reliability.
• This technique significantly enhances mechanical robustness and electrical conductivity, expanding applications in wearable electronics and electrochemical devices.
• Eliminating protective layers broadens the utility of metallic nanowires in advanced electronic applications.