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Updated: Jun 21, 2026

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
Junbo Zhang1, Bing Du1, Fuzhen Sun1
1State Key Laboratory of Advanced Forming Technology and Equipment, China Academy of Machinery, Science & Technology, Beijing 100044, China.
Inconel 718 is the best transition layer for laser cladding CoCrFeNiAl high-entropy alloy on H13 steel, preventing cracks and improving performance under stress. This finding enhances material durability for hot-work die applications.
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